Materials Characterization

Materials Characterization   
Contact: John Passero
1-800-220-3675 ext. 3604
jpassero@EMSL.com

A vast array of processes and analytical techniques are used for materials analysis and characterization. The techniques required are dependent upon the material type, sample composition, condition, form and what information the client is looking for.

The ability of EMSL’s scientists and engineers to understand clients’ needs and objectives, coupled with our vast experience in this field, ensures your process and material objectives are understood. This allows us the ability to match the right technique and method to your specific project.

The following is a partial list of EMSL’s instrumentation and techniques that are available for materials analysis and characterization. 

Chemical Analysis

• X-Ray Diffractometers (XRD)
• X-ray Fluorescence Spectrometer (WD-XRF)
• Fourier Transform Infrared Microscope; Micro FTIR (5 um spot resolution, reflected, transmitted, ATR, mapping, line profiles)
• Gas Chromatographs (GC, ECD, FID, MS, MS/MS, NPD, High Resolution, Pyrolisis)
• Carbon, Nitrogen, Sulfur, Hydrogen  Analyzers (combustion)
• Inductively Coupled Plasma Spectrometer (ICP)
• Inductively Coupled Plasma Spectrometer/ Mass Spectroscopy (ICP/MS)
• Ion Chromatography (IC)
• Liquid Chromatography–Mass Spectrometry (LC-MS)
• Liquid Chromatography-Quadrupole Mass Spectrometer (LC-MS/MS)
• High Performance Liquid Chromatography (HPLC)/Diode Array/Fluorescence Detectors
• High Performance Liquid Chromatography coupled with ICP-MS (metals speciation)
• Mercury Analyzer

Differential Scanning Calorimeter (DSC) 
Thermal Analysis

• Thermo Gravimetric Analysis (TGA)
• Differential Thermal Analysis (DTA) 
• Dynamic Mechanical Analysis (DMA)

 
Non-Destructive

• Real Time Magnified X-Ray Imaging
• High Resolution X-Ray Film Imaging
• X-Ray CT (computational Tomography)
• CSAM (Scanning Acoustic Microscopy)
• Portable XRF (Niton type analyzer)
• XRF (Plating thickness measurement)

 
Additional Testing Capabilities

• EDM Machining
• Cryo-Microtome
• Environmental Chambers (various conditions)
• Heat-Treating Furnaces (RT to 1700C)
• Zeta Potential Analyzer
• Additional Tests (offsite or special arrangement)
• Dual Beam FIB (focused ion beam) – Tons of applications
• EBSD/EBSD Mapping
• Serial Block Tomography Imaging (3D reconstruction down to nm scale of volume w/EDS/EBSD compositional analysis)
• Tensile Stage Real-Time Analysis of Strain/Compression in SEM
• X-Ray Photoelectron Spectroscopy (XPS) 
• TEM Sample Preparation and Lift Out
• High Resolution TEM Analysis (200KV + and cryoTEM)
• Surface Profile/3D Reconstruction
• Micro Raman (small areas, diamonds, graphene, ceramics)
• Atomic Force Microscopy (AFM)